ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,212, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Switching device electrically connected to a lead frame by a bo... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,213, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method for manufac... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,214, issued on July 14, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices and methods of man... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,215, issued on July 14, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Stacked layers with filling structures" was i... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,216, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Composite IC die package including IC die directly bonded to fr... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,217, issued on July 14, was assigned to Canon K.K. (Tokyo). "Semiconductor module manufacturing method, electronic equipment manufacturing ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,218, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Metal PCB for topside power delivery" was invented by Kyle Arri... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,219, issued on July 14, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a chiplet located between an integrated device and a... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,220, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Modular systems in packages, and associated devices, system... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,221, issued on July 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device with offset lower electrodes of ... Read More